CONTACT US

Hong Kong Kart Electronics Limited
Add: A501,11th block, No. 598
Jihua Road, Longgang District,
Shenzhen
Phone:86 138 2337 0129
FAX: 86 755 83340130
Email:
postmaster@kart-electronics.com

HDI PCB

HDI circuit board general information

High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB). This technics is designed to meet the requirement for the circuit boards with blind, buried vias, with high density circuit, especially for the small board with many BGA and modules. 

Application:
From the cell phone to the small protable products in the military field, users are pursuring more and more smaller products. So HDI board is used to reduce size and weight, as well as to enhance electrical performance.

HDI PCB is widely used in the mobile phone, digital camera, MP3,MP4,notebook, automotive electronics and other consumer electronics. 

Fabrication and types

HDI Circuit boards are always produced with build-up way, more build-up, more requirement to the fabrication technology. Normal HDI PCB is made with one build-up stack, complicated HDI PCB usually is design with stack hole, copper via hole, and manufactured by two build-up stack and one level, two level micro vias. These circuit boards are used for the 3G cell phone, digital camera and IC plate. 
 
1.HDI PCB (1+N+1)



2.HDI PCB (2+N+2)



Advantage of HDI PCB:
  Reduce PCB cost: when PCB layer is more than 8, HDI cost is lower than conventional fabrication 
  Increasing line density: interconnection of traditional circuit boards and parts
  Be good for use of encapsulation technology
  Better electrical performance and signal accuracy
  Better reliability
  Improve thermal properties of PCB
  Improve radio frequency interference / electromagnetic interference / static release (RFI/EMI/ESD)
  Increase design efficiency 
 
Capability:
Layer Count: 2-30 Layers
Products Type:
HF (High Frequency) & RF (Radio Frequency) board, Impedance controlled board ,
HDI board, BGA & Fine Pitch board, Heavy Copper board ( up to 7 OZ)
 
Material:
Laminate:  FR4 (SHENGYI  S1141)
HF material:  Rogers, Taconic, Arlon
High TG material:  SHENGYI / S1170, ITEQ / IT180 and related PP
Halogen Free material:  SHENGYI / S1155 / S1165
Solder Mask:  Taiyo PSR 2000/4000
Plating Chemistry:  ROHM & HASS
 
Surface Finish:
Leaded HAL, Lead free HAL, ENIG, OSP (Entek), Immersion Tin,
Immersion Silver, Hard Gold(50u")
 
Selective Surface Treatment:
ENIG + OSP, ENIG + Gold Fingers, Immersion Silver + Gold Fingers,
Immersion Tin + Gold Fingers
 
Technical Specification
Min. Trace Width/Space: 3/3mil (outer layer, finished copper 30um), 2.5/2.5mil(inner layer, 1/3 or 1/2 OZ)
Min. Hole Size: 0.15mm/6mil (mechanical drill), 0.1mm/4mil (laser drill)
Min. Annular Ring: 4mil
Min. Distance Between Layers: 2mil
Max. Finished Copper Thickness: 7 OZ
Max. Finished Board Size: 600X800mm / 23.5"*32.5"
Finished Board Thickness:  Double Sided: 0.2-7.0mm / 0.008"-0.28", Multilayer: 0.40-7.0 mm / 0.016"-0.28",
Min. Solder Mask Bridge: ≥0.08mm
Aspect ratio: 16:1
Plugging Vias Capability: 0.2-0.8mm
 
Tolerance :
Plated holes Tolerance: ±0.075mm (min.±0.05)
Non-plated hole tolerance: ±0.05mm (min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance: ±0.1mm(mils±0.05-0.075mm)
 
Functional Test:
Insulation Resistance: 50 ohms (standard)
Peel Off Strength: 1.4N/mm
Thermal Shock Test: 280 degrees F, 20 seconds
Solder Mask Hardness: ≥6H
E-Test Voltage: 10V-250V
Warp and Twist: ≤0.7%